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Plasma Enhanced Chemical Vapor Deposition

Plasma Enhanced Chemical Vapor Deposition

Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.

Compact PE-CVD (Plasma Enhanced Chemical Vapor Deposition Furnace) tube furnace system, which consists of RF plasma source,tube furnace, Multi-channels gas flowmeters with gas mixing tank, and high-quality mechanical pump.The PE-CVD furnace is an ideal and affordable tool to deposit thin films or grow nanowire from a gas state (vapor) to a solid state. 
Based on the above information,you can choose according to the PECVD furnace with gas channels & vacuum pump image and the table parameters in detail, and then contact us to get the price you expect.

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